Basa reWhite Corundum Micropowder muElectronic Packaging Materials
Vanoshanda navo, avo vanoshanda mukugadzira zvinhu uye kurongedza vanoziva kuti kunyangwe kurongedza kwemagetsi kuchinzwika kunoshamisa, chaizvoizvo zvese zvine chekuita neruzivo rwacho. Zvakafanana nekuisa sutu yekudzivirira pachipisi inokosha. Sutu iyi inofanira kutsungirira kukanganiswa (simba remakanika), kubvisa kupisa (kupisa), uye kupa kudzivirira kudziya uye kudzivirira hunyoro. Zvikanganiso mune chero chipi zvacho cheizvi zvakakosha. Nhasi, tichatarisa pane chinhu chinoshandiswa kazhinji, asi chakaoma, - white corundum micropowder - kuti tiongorore kuti chinhu ichi chidiki chinoita sei basa rakakosha musutu iyi yekudzivirira.
Ⅰ. Ngatitangei tazivana nemukurumbira: "murwi muchena" wekuchena kukuru.
Corundum chena, muchidimbu, ialuminium oxide yakachena kwazvo (Al₂O₃). Yakabatana nebrown corundum yakajairika, asi rudzi rwayo rwakachena. Kuchena kwayo kwakanyanya kunoita kuti ive neruvara ruchena, kuomarara kwakanyanya, kuramba kupisa kwakanyanya, uye hunhu hwemakemikari hwakagadzikana, zvichiita kuti isakanganiswa nezvimwe zvinhu.
Kuikuya kuita upfu hwakatsetseka hwe micron kana nanometer-scale ndiko kwatinotiupfu hwecorundum chenaMusarerutsa upfu uhwu. Muzvinhu zvemagetsi zvekurongedza, kunyanya epoxy molding compounds (EMC) kana zvinhu zveceramic packing, zvinopfuura kungowedzera chete; asi chinhu chinozadza pillar.
II. Chii chaizvo chinoshanda mupakeji yacho?
Funga nezvezvinhu zvekurongedza se "simende yakagadzirwa," resin iri "glue" yakapfava, inonamira inobatanidza zvese pamwe chete. Asi guruu chete harina kukwana; rakapfava zvakanyanya, harina simba, uye rinopwanyika kana rapiswa. Apa ndipo panopinda upfu hwe corundum chena. Zvakafanana ne "matombo" ne "jecha" zvinowedzerwa kusimende, zvichisimudzira kushanda kwe "simende" iyi padanho idzva.
Zvikuru: "Nzira yekufambisa kupisa" inoshanda zvakanaka
Chip yakafanana nechoto chidiki. Kana kupisa kusingakwanise kunyangarika, kunogona kutungamira mukudzora frequency uye kunonoka zvakanyanya, kana kutopera zvachose. Resin pachayo haifambise kupisa zvakanaka, ichivhara kupisa mukati—mamiriro ezvinhu asina kunaka zvechokwadi.
Hupfu hwe corundum chenaine simba rekupisa rakakwirira kupfuura resin. Kana huwandu hwakawanda hweupfu hukagoverwa zvakaenzana muresin, zvinobudirira kugadzira network ye "migwagwa midiki inodziya" isingaverengeki. Kupisa kunokonzerwa nechip kunokurumidza kufambiswa kubva mukati kuenda pamusoro pepakeji kuburikidza nezvidimbu zvichena zve corundum, uye zvobva zvapararira mumhepo kana mudhishi rekupisa. Upfu hwakawanda hukawedzerwa uye huchienderana zvakanaka nehukuru hwezvikamu, network iyi inodziya inowedzera kuva denderedzwa uye mvura yakawanda, uye simba rekupisa rose (TC) rezvinhu zvekurongedza rakakwirira. Midziyo yepamusoro ikozvino iri kuedza kufambisa simba rekupisa rakawanda, uye upfu huchena hwe corundum hunotungamira mune izvi.
Unyanzvi Hwakakosha: "Mutongi Wekuwedzera Kwekupisa" Wakarurama
Iri ibasa rakakosha! Chip (kazhinji silicon), zvinhu zvekurongedza, uye substrate (senge PCB) zvese zvine ma coefficients akasiyana ekuwedzera kwekupisa (CTE). Zvichitaurwa zviri nyore, kana zvichipiswa, zvinokura uye zvinokotama kusvika padanho rakasiyana. Kana kuwedzera uye kukotama kwezvinhu zvekurongedza kwakasiyana zvakanyanya nekwechip, kushanduka kwekushisa, tembiricha inochinjana inotonhora uye inopisa, zvichaunza kushushikana kukuru mukati. Izvi zvakafanana nevanhu vakati wandei vari kudhonza chipfeko munzira dzakasiyana. Nekufamba kwenguva, izvi zvinogona kukonzera kuti chip itsemuke kana kuti majoini e solder arege kushanda. Izvi zvinonzi "thermomechanical failure."
Upfu hwecorundum chena ine chiyero chekuwedzera chekupisa chakaderera zvikuru uye yakagadzikana zvikuru. Kuiisa mu resin kunoderedza zvakanyanya chiyero chekuwedzera kwekupisa chechinhu chose chakabatanidzwa, zvichienderana zvakanyanya nesilicon chip ne substrate. Izvi zvinoita kuti zvinhu zviwedzere uye zvigonoke pamwe chete panguva yekuchinja-chinja kwekushisa, zvichideredza zvakanyanya kushushikana kwemukati uye kuvandudza kuvimbika kwemudziyo uye hupenyu hwese. Izvi zvakafanana nechikwata: kana vachishanda pamwe chete ndipo pavanogona kuita chimwe chinhu.
Unyanzvi Hwekutanga: "Chinosimbisa Mapfupa" Chine Simba
Mushure mekuoma, resin yakachena ine simba remagetsi, kuomarara, uye kuramba kupera. Kuwedzera hupfu hwecorundum chena hwakasimba uye hwakasimba kwakafanana nekuisa mabhiriyoni e "mapfupa" akaoma mukati meresin yakapfava. Izvi zvinounza zvakananga mabhenefiti matatu makuru:
Kuwedzerwa kwemodulus: Chigadzirwa chacho chakasimba uye hachikurumidzi kuchinja, zvichidzivirira zviri nani waya dzemukati dzechip negoridhe.
Simba rakawedzerwa: Simba rekuchinjika uye rekudzvanya rinowedzerwa, zvichiita kuti rikwanise kutsungirira kuvhunduka kwekunze uye kushushikana.
Kusakweshana uye kuramba hunyoro: Pamusoro pechikafu chakaoma uye hachina kukweshana. Uyezve, kuzadza kwacho kwakasimba kunoderedza nzira yekupinda kwehunyoro, zvichivandudza kuramba hunyoro.
Ⅲ. Ingoiwedzera here? Kudzora mhando ndiko kwakakosha!
Panguva ino, ungafunga kuti zviri nyore—ingowedzera hupfu hwakawanda sezvaunokwanisa muresin. Apa ndipo pane hunyanzvi chaihwo. Rudzi rwehupfu hwekuwedzera uye maitirwo ahwo akaomarara.
Kuchena ndicho chinhu chikuru: Electronic grade uye ordinary abrasive grade zvinhu zviviri zvakasiyana. Kunyanya, huwandu hwetsvina yesimbi yakaita se potassium (K) uye sodium (Na) hunofanira kudzorwa kusvika padanho rakaderera re ppm. Tsvina iyi inogona kufamba munzvimbo dzemagetsi nenzvimbo dzine hunyoro, zvichikonzera kubuda kwecircuit kana kunyange short circuits, chinhu chinotyisidzira kuvimbika. "Chena" haisi ruvara chete; inomiririra kuchena. Saizi yezvikamu uye grading imhando yehunyanzvi: Fungidzira dai zvikamu zvese zvaive saizi imwechete, paizova nemikana pakati pazvo. Tinofanira "kuyera" micropowders yehukuru hwakasiyana kuitira kuti zvikamu zvidiki zvizadze mikaha iri pakati pezvikamu zvikuru, zvichiwana huwandu hwepamusoro hwekurongedza. Kuwanda kwepacking density kunopa nzira dzekupisa dzakawanda uye kudzora zviri nani kwe thermal expansion coefficient. Panguva imwe chete, saizi yezvikamu haifanirwe kunge yakanyanya kuomarara, izvo zvaizokanganisa processing fluidity uye surface finish; kana kupfava zvakanyanya, sezvo izvi zvaizogadzira nzvimbo yakakura yepamusoro uye zvichibvumira resin yakawandisa kunyudzwa, kuderedza kuzadza uye kuwedzera mari. Kugadzira uku kugoverwa kwezvikamu chimwe chezvakavanzika zvikuru zveimwe neimwe fomura.
Maumbirwo echinhu uye kugadziriswa kwechinhu pamusoro pechinhu zvakakosha: Chimiro chechinhu chinofanira kunge chakarongeka, chakaenzana, chine makona mashoma akapinza. Izvi zvinoita kuti resin ifambe zvakanaka uye inoderedza kushushikana. Kugadziriswa kwechinhu pamusoro pechinhu kwakakosha zvikuru.Corundum chenainonyungudutsa mumvura, nepo resin ichinyungudutsa mumvura, zvichiita kuti isawirirane zvachose. Nokudaro, pamusoro peupfu hudiki hunofanira kuputirwa nechinhu chinosanganisa silane, zvichiita kuti huve "organic coating." Nenzira iyi, upfu hunogona kubatanidzwa zvakanyanya neresin, zvichidzivirira kuti interface isave isina simba iyo inokonzera kutsemuka kana yasangana nehunyoro kana kushushikana.